Viasystems Group Inc (NASDAQ:VIAS)

Data as of Sep 22
 +4.10 / +35.04%
Today’s Change
Today|||52-Week Range
Electronic Technology
Electronic Components

Company Description

Viasystems Group, Inc. provides complex multi-layer rigid, flexible and rigid-flex printed circuit boards and electro-mechanical solutions. The company operates through two segments: Printed Circuit Boards and Assembly. The Printed Circuit Boards segment consists of the company's printed circuit board products and manufacturing facilities located in the United States, Canada and China. These facilities manufacture double-sided and multi-layer printed circuit boards and back panels. It also provides both the circuitry and mounting surfaces necessary to interconnect discrete electronic components, such as integrated circuits, capacitors and resistors. The Assembly segment include Electro-Mechanical Solutions, which consists of assembly operations, including back panel assembly, printed circuit board assembly, cable assembly, fabrication of custom and standard metal enclosures, cabinets, racks, sub-racks and bus bars, systems integration, final assembly and product testing. Viasystems Group was founded on August 28, 1996 and is headquartered in St. Louis, MO.

Contact Information

Viasystems Group, Inc.
101 South Hanley Road
St. Louis Missouri 63105
P:(314) 727-2087
Investor Relations:
(314) 746-2217



Individual stakeholders97.48%
Other institutional7.47%
Mutual fund holders17.91%

Top Executives

David M. SindelarChief Executive Officer & Director
Timothy L. ConlonPresident, Chief Operating Officer & Director
Gerald G. SaxChief Financial Officer & Senior Vice President
Scot M. HunterChief Information Officer & Vice President
Christopher R. IsaakChief Accounting Officer, VP & Controller

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