Viasystems Group Inc (NASDAQ:VIAS)

Delayed Data
As of May 26
 -0.10 / -0.55%
Today’s Change
Today|||52-Week Range
Electronic Technology
Electronic Components

Company Description

Viasystems Group, Inc. is a provider of complex multi-layer printed circuit boards (PCBs) and Electro-Mechanical Solutions to Original equipment manufacturers. It provides advanced-technology printed circuit boards, large format backplanes and assemblies, custom sheet metal and enclosures, cabinets, racks and subracks, and electro-mechanical assemblies all the way through Level 5 Integration. The company operates through two business segments: Printed Circuit Boards and Assembly. The Printed Circuit Boards segment consists of printed circuit board manufacturing facilities located in the United States, Canada and China. These facilities manufacture double-sided and multi-layer printed circuit boards and backpanels. The Assembly segment consists of assembly operations including backpanel assembly, printed circuit board assembly, cable assembly, custom enclosure fabrication, and full system assembly and testing. Viasystems Group was founded on August 28, 1996 and is headquartered in St. Louis, MO.

Contact Information

Viasystems Group, Inc.
101 South Hanley Road
St. Louis Missouri 63105
P:(314) 727-2087
Investor Relations:
(314) 746-2217



Individual stakeholders97.42%
Mutual fund holders16.64%
Other institutional11.12%

Top Executives

David M. SindelarChief Executive Officer & Director
Timothy L. ConlonPresident, Chief Operating Officer & Director
Gerald G. SaxChief Financial Officer & Senior Vice President
Scot M. HunterChief Information Officer & Vice President
Christopher R. IsaakChief Accounting Officer, VP & Controller

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